T-pregTM HTD is used in conjunction with copper foil and an integral metal plate to provide a circuit board laminate that has superior thermal management capabilities and a 150°C continuous use temperature.

T-lam SS HTD is a thermT-lam SS HTD is a thermally conductive PCB substrate. The construction consists of a copper circuit layer bonded to an aluminum or copper base plate with 150 C rated T-lam HTD dielectric.

T-lam SS 1KA is a thermally conductive PCB Substrate. The substrate consists of a copper circuit layer bonded to an aluminum or copper base plate with Laird Technologies' 3 watt/m-K 1KA dielectric.