ARLON Materials for Electronics Division
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Datasheets:
25N, 25FR
25N/25FRŪ Arlon Microwave
104Kb
33N
POLYIMIDE LAMINATE AND PREPREG
252Kb
35N
POLYIMIDE LAMINATE AND PREPREG
253Kb
35NQ
POLYIMIDE Quartz LAMINATE AND PREPREG
253Kb
37N
POLYIMIDE LOW-FLOW PREPREG
782Kb
38N
POLYIMIDE LOW-FLOW PREPREG
235Kb
44N
MULTIFUNCTIONALMICRODISPERSED CERAMIC FILLED EPOXY-FIBERGLASS PREPREG
236Kb
45N
MULTIFUNCTIONAL EPOXY LAMINATE AND PREPREG
248Kb
45NK
WOVEN KEVLAR REINFORCED LAMINATE AND PREPREG
258Kb
47N
EPOXY LOW-FLOW PREPREG
248Kb
49N
MULTIFUNCTIONAL EPOXY LOW-FLOW PREPREG
808Kb
51N
Multifunctional, High Tg Epoxy Low-Flow Prepreg
352Kb
55LM
EPOXY NONWOVEN ARAMID LAMINATE AND PREPREG
240Kb
55NT
EPOXY NONWOVEN ARAMID LAMINATE AND PREPREG
234Kb
55ST
EPOXY NONWOVEN ARAMID LAMINATE AND PREPREG
238Kb
84N
POLYIMIDE Laminate and Prepreg
246Kb
85N
POLYIMIDE Laminate and Prepreg
246Kb
85NT
POLYIMIDE NONWOVEN ARAMID LAMINATE AND PREPREG
246Kb
91ML
THERMALLY CONDUCTIVE MULTILAYERABLE EPOXY LAMINATE AND PREPREG
107Kb
92ML
THERMALLY CONDUCTIVE MULTILAYERABLE EPOXY LAMINATE AND PREPREG
108Kb
99ML, 99ML0690, 99ML8084
THERMALLY CONDUCTIVE MULTILAYERABLE EPOXY LAMINATE AND PREPREG
1.49Mb
AD5
PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
30Kb
AD10
PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
554Kb
AD255A
PTFE/Woven Fiberglass/Micro-Dispersed Ceramic Filled Laminate for RF & Microwave Printed Circuit Boa
107Kb
AD260A
PTFE/Woven Fiberglass/Micro-Dispersed Ceramic Filled Laminate for RF & Microwave Printed Circuit Boa
77Kb
AD300A
PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate for RF & Microwave Printed Circuit Boards
109Kb
AD320A
PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate for RF & Microwave Printed Circuit Boards
111Kb
AD350A
PTFE/Woven Fiberglass/Ceramic Filled
620Kb
AD410
PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate for RF & Microwave Printed Circuit Boards
273Kb
AD430
PTFE/Woven Fiberglass/Micro-Dispersed Ceramic Filled Laminate for RF & Microwave Printed Circuit Boa
220Kb
AD450
PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
117Kb
AD600
PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
139Kb
AD1000
PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
137Kb
AD250, AD300, AD320
PTFE/Woven Fiberglass Laminates Microwave Printed Circuit Board Substrates
674Kb
AR1000
PTFE/Woven Fiberglass Ceramic Filled High Er Laminates
587Kb
Howefill HF 50
Ceramic Filled High Tg Polyimide Hole Fill Compound
57Kb
CLTE-AT
Commercial Version of CLTE-XT Excellent Dimensional Stability with High Degree of Phase Stability vs
158Kb
CLTE-XT
The Next Generation of CLTE with Lowest Loss in its Class Excellent Dimensional Stability with Highe
177Kb
CLTE
Dimensionally and Electrically Stable Microwave Printed Circuit Board Substrates
164Kb
CuClad217, CuClad233, Cuclad250
PTFE/Woven Fiberglass Laminates Microwave Printed Circuit Board Substrates
257Kb
6250, 6700
CuClad 6250 and 6700 Bonding Films
552Kb
DiClad880, DiClad870, DiClad522/527
PTFE/Woven Fiberglass Laminates
225Kb
IsoClad917, IsoClad933
PTFE/Nonwoven Fiberglass Laminates
647Kb
AD PIM -250, -300, -320, -350, DiClad880-PIM
Reduced Passive Intermodulation (PIM)
490Kb
TC350
Enhanced Thermal Conductivity Ceramic Filled PTFE/ Woven Fiberglass Laminate for Microwave Printed Circuits Boards
109Kb
TC600
Enhanced Thermal Conductivity Ceramic Filled PTFE/Woven Fiberglass Laminate for Microwave Printed Circuit Boards
133Kb